“Current popular web bonding technologies for wipes, such as spunlace and airlaid, do not themselves do enough to impart differentiated features that capitalize on the rapidly evolving wipes market,” says Makarand Gawade, global marketing manager – Nonwovens and Textiles Enhancements at OMNOVA. “In response, OMNOVA is introducing the Tribute technology platform that can enable thinner, softer, more absorbent, durable, lint-free wipes as well as significant advantages in substitution of substrate components without impacting performance."
OMNOVA’s Tribute technology platform is a three-part solution that includes special Sunbond and Acrygen binders and the innovative SoftWick SF20 surface treatment. Sunbond improves dry/wet strength, helps create lint-free substrates, and provides reduced quaternary absorption. Acrygen improves softness, hand/feel and significantly improves abrasion resistance. SoftWick SF20 imparts best in class wicking performance, excellent hydrophilicity, and significantly improves liquid absorption capacity, while adding softness.
The technology platform is ideal for use on polypropylene, polyester, PLA, and multi-fiber component substrates, and it opens the door to substitution or rebalancing of substrate components.
“Current viscose market dynamics encourage substitution, however with reduced viscose content, spunlaced wipes may lose absorption capacity and softness. With SoftWick finishing treatment, a wipes producer would be able to reduce the quantity of viscose fibers and yet achieve similar or even improved performance,” says Gawade. “And because there is strong ionic compatibility between all the platform elements, the individual OMNOVA products can be used standalone or in tandem, based on the performance requirements.”