08.05.19
Eric Shawn Goudy, Liberty Township, OH; Jason Lee DeBruler, West Chester, OH; and Michael Devin Long, Springfield Township, OH.
Assigned to The Procter & Gamble Company, Cincinnati, OH.
Filed: 12/9/16
Issued: 6/4/19
A method for forming a bond, the method comprising the steps of: advancing a substrate assembly in a machine direction, wherein the substrate assembly comprises a process product pitch defined by a leading portion and a trailing portion, and a central portion between the leading portion and the trailing portion; rotating a bonder apparatus about an axis of rotation, wherein the bonder apparatus comprises a plurality of manifolds disposed about a central longitudinal axis, wherein the plurality of manifolds comprise a first manifold, as second manifold, and one or more manifolds disposed between the first manifold and the second manifold, and wherein each of the plurality of manifolds comprises a support plate and a nozzle plate adjacent the support plate, wherein the nozzle plate defines a plurality of apertures; receiving the leading portion of the substrate on the support plate of the first manifold; receiving the trailing portion of the substrate on the support plate of the second manifold, wherein the central portion of the substrate is disposed on the support plates of the one or more manifolds disposed between the first manifold and the second manifold; heating a fluid to form a heated fluid; supplying the heated fluid to the plurality of manifolds; releasing the heated fluid through the plurality of apertures defined by the nozzle plate of the first manifold such that the heated fluid engages the leading portion; releasing the heated fluid through the plurality of apertures defines by the nozzle plate of the second manifold such that the heated fluid engages the trailing portion; and bonding at least a portion of the substrate assembly.
Assigned to The Procter & Gamble Company, Cincinnati, OH.
Filed: 12/9/16
Issued: 6/4/19
A method for forming a bond, the method comprising the steps of: advancing a substrate assembly in a machine direction, wherein the substrate assembly comprises a process product pitch defined by a leading portion and a trailing portion, and a central portion between the leading portion and the trailing portion; rotating a bonder apparatus about an axis of rotation, wherein the bonder apparatus comprises a plurality of manifolds disposed about a central longitudinal axis, wherein the plurality of manifolds comprise a first manifold, as second manifold, and one or more manifolds disposed between the first manifold and the second manifold, and wherein each of the plurality of manifolds comprises a support plate and a nozzle plate adjacent the support plate, wherein the nozzle plate defines a plurality of apertures; receiving the leading portion of the substrate on the support plate of the first manifold; receiving the trailing portion of the substrate on the support plate of the second manifold, wherein the central portion of the substrate is disposed on the support plates of the one or more manifolds disposed between the first manifold and the second manifold; heating a fluid to form a heated fluid; supplying the heated fluid to the plurality of manifolds; releasing the heated fluid through the plurality of apertures defined by the nozzle plate of the first manifold such that the heated fluid engages the leading portion; releasing the heated fluid through the plurality of apertures defines by the nozzle plate of the second manifold such that the heated fluid engages the trailing portion; and bonding at least a portion of the substrate assembly.
