Breaking News

Frontal Tape Bonder

August 17, 2005

ATS Engineering S.r.l. and Herrmann Ultraschalltechnik GmbH & CO. KG has developed a module using Hermann's patented non-contact/non-wear technology with Microgap control to ultrasonically bond frontal tapes to the back sheet material of diapers and incontinence products. The module's high flexibility allows for a wide range of designs for the frontal tape-from narrow widths for baby diapers to wide, split tapes for adult incontinence products.

This advanced bonding technology works without the use of external heat. Instead, the bond is established through high frequency ultrasonic vibrations that enable both energy and costs to be reduced while simultaneously preserving the soft and lofty quality of the nonwovens.


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