Adhesive Resin Composition And Adhesive Agent In Film Form, And Semiconductor Device Using The Same

February 10, 2009

An adhesive resin composition was patented. It comprises a thermoplastic polyimide obtained by reacting a diamine component comprising a diamine represented by the following formula (1) with a tetracarboxylic acid dianhydride, and a thermosetting resin contained in the ratio of from 1 to 200 weight parts, based on 100 weight parts of the thermoplastic polyimide. In the formula (1), Rs are each independently an atom or a group selected from the group consisting of a hydrogen atom, a halogen atom and a hydrocarbon group; n is a positive number of 1 to 50 on an average; Y represents an alkylene group having 2 to 10 carbons or an alkyl ether group having 2 to 10 carbons; and Ys may be the same or different when n is not less than

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