Adhesive Composition And Sheet Having An Adhesive Layer Of The Composition
Patent #: 7,488,539
Inventor(s): Shouhei Kozakai and Nobuhiro Ichiroku
Company: Shin-Etsu Chemical Co., Ltd.
Patented is a dicing and die bonding sheet comprising a substrate, a pressure sensitive silicone adhesive layer on the substrate and an adhesive layer on the pressure sensitive silicone adhesive layer. The latter adhesive layer is prepared from an adhesive composition comprising 5-60 weight percent of (A) a polyimidesilicone resin; 5-60 weight percent of (B) an epoxy resin having a softening point of 80° C. or lower; 0.001 to 20 weight percent of (C) dicyandiamide; 20 to 70 weight percent of (D) spherical silica having an average diameter of 0.1 to 10 μm; and 5 to 30 weight percent of (E) spherical fine particles of silicone rubber composite, wherein the weight percent is based on a total weight of the adhesive composition. A 180-degree peel force measured by peeling off the pressure sensitive adhesive layer from the adhesive layer is located on the pressure sensitive silicone adhesive layer and ranges from 0.05 to 1.0 N/25 mm.
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