Pressure-Sensitive Adhesive Film For The Surface Protection Of Semiconductor Wafers And Method For Protection Of Semiconductor Wafers With The Film
Published April 10, 2007
A surface protecting adhesive film for a semiconductor wafer has been patented. A base film has at least one layer of a synthetic resin where the base film has a storage elastic modulus (E’) at 25°C of from 1x108 to 1x1010 Pa and where the base film has a thickness of 10 Ìm to 120 Ìm. An adhesive layer of 5 to 50 Ìm in thickness is formed on one surface of the base film. The adhesive layer comprises 100 weight parts of a polymer (A) with a functional group capable of reacting with a cross-linking agent and a temperature (Ta) in a range of from -50°C to 5°C Tan% of a dynamic viscoelasticity of the polymer(A), which is maximized, from 10 weight parts to 100 weight parts of a polymer (B) with a functional group capable of reacting with a cross-linking agent and a temperature (Tb) in a range of from more than 5°C to 50°C Tan% of a dynamic viscoelasticity of the polymer(B), which is maximized and from 0.1 weight part to 10 weight parts of a crosslinking agent (C) has two or more cross-linkable functional groups in a molecule based on 100 weight parts of total amount of the polymers (A) and (B). The adhesive force of the surface protecting adhesive film for the semiconductor wafer is measured on the basis of a method defined in JIS Z0237 using a SUS304-BA plate as an adherent, at a peeling rate of 300 mm/min and a peeling angle of 180° is from 1 N/25 mm to 15 N/25 mm.