Microstructed Release Liner
Patent #: 6,984,427
Inventor(s): Robert Galkiewicz, Brian Spiewak, Dennis Nichols and Janet Kirkman
Company: 3M Innovative Properties Company
An article comprising an adhesive layer, a backing layer in contact with the adhesive layer and a release liner layer has been granted a patent. The release liner layer comprises a first surface in contact with the adhesive layer and a second surface, wherein the first surface is embossed to provide a plurality of outwardly extending protrusions that penetrate the adhesive layer to make substantial contact with the backing layer. The adhesive layer does not contact the land of the release liner layer.
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