Heat-Sensitive Adhesive Material, Method Of Preparing Same And Method Of Using Same
Patent #: 6,828,017
Inventor(s): Tomoyuki Kugo and Toshiaki Ikeda
Company: Ricoh Company, Ltd.
Filed: 2001-09-25
Issued: 2004-12-07
Description:
Patented is a heat-sensitive adhesive composition made of a thermoplastic resin, a solid plasticizer and a supercooling improving agent. The supercooling improving agent is in the form of particles having an average particle diameter of 0.2-10 Ìm and such a particle size distribution that at least 90% by weight have a particle diameter of not greater than 20.0 Ìm.
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