A pressure-sensitive hotmelt adhesive has been patented. The adhesive is comprised of a number of adhesive components. The pressure-sensitive hotmelt adhesive is in the form of a granule that has at least one compact outer layer of at least one of the adhesive components, where at least one compact outer layer is not pressure-sensitive up to 45° C. A core of at least one of the adhesive components is surrounded by the outer layer.