The Microbond CSI technology energy is only directed to the weld bond points and does not further restrict the filter laminate, nor change the fiber content; with typical thermal bonding heat radiates outside the bond zone.
- Small bond points safeguard against restricted airflow, a common problem when using adhesives.
- Multi-laminate structures with/without mesh reinforcement can simultaneously be incorporated.
- Pinholes are eliminated using the Microbond CSI technology.
- Loss of performance due to bonding errors is reduced to 0.5-4%.
Herrmann Ultrasonics has become the technology leader in ultrasonic welding by developing the most advanced products, providing ultrasonics engineering expertise and total solution offerings. The ultrasonic process can be used in the final assembly of the filtration product. Herrmann Ultrasonics is focused on providing ultrasonic welding technology for various markets such as the consumer, medical, food, hygiene and automotive industries.