05.02.16
Booth 1621
Herrmann Ultrasonics has increased the process rate capabilities of its high-speed ultrasonic laboratory calender (ULC 500), now aptly named the ULC 600+. This latest advancement to the North American headquarters modern lab calender makes it feasible to run at 2000 feet per minute. Customers utilize Herrmann Ultrasonics’ Nonwoven Lab for material evaluation, feasibility tests and consultations on how ultrasonics technology can be incorporated into their production environment. With a faster lab calender the technology leader is now better equipped to develop process solutions.
The Microbond system patented by Herrmann Ultrasonics is the optimum solution for a variety of product requirements. Rotary sonotrodes in combination with the MicroGapControl technology of the VE Microbond RSD offer a completely new perspective for processing sensitive material in high-speed performance. This new technology enables the production of a soft and tight weld. Longitudinal seams, cross seams and laminations are successful ultrasonic applications including bonding modern materials like foamed material and carbon fibers.
It is important to reduce the friction occurring in the joining area during the continuous weld processes. This prevents wrinkling and shear forces that may have a negative influence on the material structure. The rotary sonotrodes are redirecting the induced vibration to radial direction. The sonotrode and rotary anvil are rotating synchronously. This ensures gentle welding and only a slight friction resistance of fleecy or intermittently fed materials.
The precise bearing technology of the Ultraspin module provides a high degree of concentric run-out and therefore allowing constant product quality at production speeds of up to 2500 feet per minute, achieved at global headquarters in Germany.
The new generation of Herrmann ultrasonic welding modules exhibits high-speed production with consistent quality, eliminating the use of adhesives and other consumables allowing replacement of hot melt and thermal calender applications. The process becomes clean and manageable.
www.herrmannultrasonics.com
Herrmann Ultrasonics has increased the process rate capabilities of its high-speed ultrasonic laboratory calender (ULC 500), now aptly named the ULC 600+. This latest advancement to the North American headquarters modern lab calender makes it feasible to run at 2000 feet per minute. Customers utilize Herrmann Ultrasonics’ Nonwoven Lab for material evaluation, feasibility tests and consultations on how ultrasonics technology can be incorporated into their production environment. With a faster lab calender the technology leader is now better equipped to develop process solutions.
The Microbond system patented by Herrmann Ultrasonics is the optimum solution for a variety of product requirements. Rotary sonotrodes in combination with the MicroGapControl technology of the VE Microbond RSD offer a completely new perspective for processing sensitive material in high-speed performance. This new technology enables the production of a soft and tight weld. Longitudinal seams, cross seams and laminations are successful ultrasonic applications including bonding modern materials like foamed material and carbon fibers.
It is important to reduce the friction occurring in the joining area during the continuous weld processes. This prevents wrinkling and shear forces that may have a negative influence on the material structure. The rotary sonotrodes are redirecting the induced vibration to radial direction. The sonotrode and rotary anvil are rotating synchronously. This ensures gentle welding and only a slight friction resistance of fleecy or intermittently fed materials.
The precise bearing technology of the Ultraspin module provides a high degree of concentric run-out and therefore allowing constant product quality at production speeds of up to 2500 feet per minute, achieved at global headquarters in Germany.
The new generation of Herrmann ultrasonic welding modules exhibits high-speed production with consistent quality, eliminating the use of adhesives and other consumables allowing replacement of hot melt and thermal calender applications. The process becomes clean and manageable.
www.herrmannultrasonics.com
