ITW Dynatec to Present Three Technologies

03.05.18

All offer increased flexibility

The UltraLink applicator platform from ITW Dynatec is the first high-speed modular applicator platform that provides increased pattern flexibility and decreases the total cost of ownership (spare parts inventory, maintenance time and product life span). A portion of the technology (Ultra Strand Coating System) was a finalist for the IDEA16 Achievement Awards. ITW’s Velocity metering platform is an innovative high-speed technology that greatly increases the accuracy of glue application and when used in conjunction with Ultra achieves even greater savings. Meanwhile, Simplicity: 2017 Innovation for Packaging applications is specially designed to be simple to install, use, and maintain.

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