Herrmann Ultrasonics’ new ultrasonic lab is now available at its North American headquarters in Schaumburg, IL for application development. The nonwovens lab calender uses ultrasonic bonding, embossing, slitting or cutting and sealing technology at speeds up to 1000 feet/min (300 m/min.) and bonding widths of up to eight inches (200 mm). Unique features include Herrmann Ultrasonics’ patented non-contract/ non-wear technology with Microgap control, which allows bonding at high speeds while virtually eliminating wear between the sonotrode and the anvil drum. The state-of-the-art ultrasonic bonding technology combined with web tension control capabilities enables a range of trial possibilities from basic feasibility studies to in-depth application development and simulation of the ultrasonic bonding process of the future production line. A variety of anvil drums allows bonding patterns meeting the requirements of each individual application.