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Lab Calender

July 18, 2006

Herrmann Ultrasonics’ new ultrasonic lab  is now  available at  its North American  headquarters in Schaumburg, IL for  application development. The  nonwovens lab calender uses  ultrasonic bonding, embossing, slitting or cutting and sealing technology at  speeds up to 1000 feet/min (300  m/min.) and bonding widths of up to eight inches (200 mm). Unique features  include Herrmann Ultrasonics’ patented  non-contract/ non-wear technology with Microgap control,  which allows bonding at high speeds  while virtually eliminating wear between  the sonotrode and the anvil drum. The  state-of-the-art ultrasonic bonding  technology combined with web tension control capabilities enables a range of trial possibilities from basic  feasibility studies to in-depth application development and simulation of the ultrasonic bonding process of the  future production line.  A variety of anvil drums allows bonding patterns meeting the requirements   of each individual application.
847-985-7344
www.hermannultrasonics.com

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