Multi-layer Polyimide Films and Flexible Circuit Substrates Therefrom
Patent #: 7,452,610
Inventor(s): Kenji Uhara
Company: Du Pont Toray Company Limited
A multi-layer polyimide film, comprising two or more polyimide film layers has been granted a patent. At least one of the two or more polyimide film layers is obtained by imidizing a polyamic acid obtained from the reaction of at least one aromatic diamine containing 1-100 mol percent of carboxy-4,4’-diaminobiphenyl of Formula 1: m and n represent integers of four or less, including 0, and (m+n) is an integer of one or greater, and at least one aromatic tetracarboxylic dianhydride or a derivative thereof.
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