Heat-sensitive Adhesive Material, Adhered Article, Process and Apparatus for Thermally Activating the Heat-sensitive Adhesive Material
Patent #: 7,452,595
Inventor(s): Mitsunobu Morita, Tomoyuki Kugo, Hiroshi Goto and Norihiko Inaba
A heat-sensitive adhesive material comprising has been granted a patent. It includes a substrate and a heat-sensitive adhesive layer comprising a thermoplastic resin and a solid plasticizer. It is configured as to be heated and applied to an adherend. The heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend. The solid plasticizer comprises at least two different benzotriazole derivatives selected from compounds represented by following formula: R1 is one of a hydrogen atom, a halogen atom and an alkyl group; m is an integer of one to four; and X is one of a hydrogen atom, an alkyl group, an aryl group, an aralkyl group and a group represented by following formula: R2 is one of a hydrogen atom, a halogen atom, an alkyl group and hydroxyl group and n is an integer of one to five.
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