A method has been patented for modifying the electrostatic dissipative characteristics of a substrate. The method includes applying a polymer to the substrate. The polymer has metallocene moieties as constituents of the polymer structure. The metallocene moieties are of sufficient proximity to one another within the polymer structure so as to interact and promote charge propagation. The content of metallocene within the polymer structure is from approximately 1% to 10% by molecular weight. The charge buildup of the substrate is decreased and the charge dissipation of the substrate is increased by applying the polymer. The metallocene moieties are pendant from the polymer backbone.